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Our principals' technologies and services include:
- Project management for military approved total unit level builds and supply chain managment
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- High-speed digital circuit design and FPGA development. Product refreshment to re-design and engineer component replacement on legacy designs
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- Thermal management substrates, microwave Rf substrates, HDI construction
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- Blind and buried via PCBs
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- Controlled impedance multilayers
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- Fine cicrcuit line processing down to 2 mil space/trace technology
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- SMT assembly & electronics contract manufacturing to include materials management & testing
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- Electronics contract manufacturing (CM) to include BGA, SMT, ESS & unit level build
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- RF PCB assembly and expanded functional test and HASS test capabilities
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